Testing

& Analysis

Mechanical Testing Capabilities

Most analysis isn’t complete without some form of mechanical testing, which we have the ability to perform in-house. Our mechanical testing equipment includes a Shimatzu Uniaxial Testing machine, as well as Vickers and Rockwell hardness testers and a digital force gauge.

Microstructural & Dynamic Testing 

As an advanced material development company, it’s critical to have state of the art tools available for testing and analysis. Loukus Tech has the right tools for all of your mechanical and microstructural analysis needs.

A typical project includes mechanical testing, like a 3-point bend or tensile testing. Other projects focus on determining  product uniformity and the material content along the coated surface. Our team has experience in a range of testing and analysis applications. 

Scanning Electron Microscope 

The Zeiss Evo 10 scanning electron microscope (SEM) is a research grade tungsten source SEM that is coupled with energy dispersive x-ray spectrometer (EDS). It provides some convenient and unique ways to achieve the desired images with the optimized combination of resolution, image quality and depth of field. The Bruker X-ray detector associated with the system can be easily used to perform composition studies on a wide variety of materials. Nano-microstructural features can be viewed with 5 nanometer resolution and over 100,000x magnification.

Providing Solutions 

Under ideal conditions, the resolution in secondary electron imaging mode is less than 5nm and can reveal both morphology and composition for a wide range of materials. In addition to internal R&D, Loukus Tech uses this equipment to solve customer problems. Recently, a customer was having problems with the durability of laser marking. We were able to use our SEM to analyze these marks before and after durability tests, ultimately leading to a modified laser processing method that proved to be more durable.

Call Loukus Tech today for material testing and metallurgical analysis needs.

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